misk@sopuli.xyz to Technology@lemmy.worldEnglish · 3 months agoTSMC's 2nm process will reportedly get another price hike — $30,000 per wafer for latest cutting-edge techwww.tomshardware.comexternal-linkmessage-square41fedilinkarrow-up1191arrow-down11file-text
arrow-up1190arrow-down1external-linkTSMC's 2nm process will reportedly get another price hike — $30,000 per wafer for latest cutting-edge techwww.tomshardware.commisk@sopuli.xyz to Technology@lemmy.worldEnglish · 3 months agomessage-square41fedilinkfile-text
minus-squareempireOfLove2@lemmy.dbzer0.comlinkfedilinkEnglisharrow-up1·3 months agoAbsolutely. 3D stacking is becoming viable too, as AMD has proven with their X3D chips with massive gobs of L3 cache stacked on top of the logic dies. Vertical stacking and sheer die size is going to make total power density only continue to go up.
Absolutely. 3D stacking is becoming viable too, as AMD has proven with their X3D chips with massive gobs of L3 cache stacked on top of the logic dies. Vertical stacking and sheer die size is going to make total power density only continue to go up.